Premium Electronic Materials

Boost Assembly Yield with Consistent Soldering Solutions

ITEX solder pastes and wires are engineered to reduce defects, bridges, and voids—so you ship more good boards with less rework. Consistent lot-to-lot performance means fewer surprises and smoother production planning.

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Product range

ITEX Soldering Materials Lineup

ITEX materials are designed for stable processing and reliable joints on modern assemblies. From fine-pitch SMT pastes to precision cored wires, we cover your production needs with proven Sn63/Pb37 and silver-containing alloys.

ITEX Sn63/Pb37 Type 4 no-clean solder paste in bottle packaging
ITEX Sn63/Pb37 · Type 4

Fine-pitch no-clean paste for high-yield SMT lines.

500 g bottle Contains lead No-clean 183 °C melting
  • Optimized for fine-pitch stencils and dense layouts.
  • Consistent paste roll and release for stable print volumes.
Packaging Bottle
Alloy Sn63/Pb37
Contains lead Yes
Flux type No-clean
Unit weight 500 g
Powder type Type 4
Melting point 183 °C
ITEX Sn63/Pb37 Type 3 no-clean solder paste in bottle packaging
ITEX Sn63/Pb37 · Type 3

Robust all-round paste for standard SMT assemblies.

500 g bottle Contains lead No-clean 183 °C melting
  • Balanced printability for a wide range of boards and apertures.
  • Reliable reflow performance with good wetting on common finishes.
Packaging Bottle
Alloy Sn63/Pb37
Contains lead Yes
Flux type No-clean
Unit weight 500 g
Powder type Type 3
Melting point 183 °C
ITEX Sn62.9/Pb36.9/Ag0.2 Type 4 no-clean solder paste in bottle packaging
ITEX Sn62.9/Pb36.9/Ag0.2 · Type 4

Ag-containing alloy for demanding joints and pads.

500 g bottle Contains lead No-clean 183 °C melting
  • Ag addition supports improved joint reliability on critical connections.
  • Fine Type 4 powder (20–38 μm) for precise stencil printing.
Packaging Bottle
Alloy Sn62.9/Pb36.9/Ag0.2 (20–38 μm)
Contains lead Yes
Flux type No-clean
Unit weight 500 g
Powder type Type 4
Melting point 183 °C
ITEX Sn63/Pb37 Solder Wire Spool
ITEX Sn63/Pb37 · Solder Wire

High-purity cored wire for manual soldering and rework.

500 g spool Contains lead Rosin core
  • Fast wetting and low spatter for efficient manual assembly.
  • Standard 2.0% flux core content for reliable joint formation.
Packaging Spool
Alloy Sn63/Pb37
Diameter 0.8 mm (Standard)
Flux Core 2.0%
Unit weight 500 g
Melting point 183 °C

Note: ITEX solder pastes above contain lead and are intended for professional electronics manufacturing environments. Please follow local regulations and appropriate protective measures.

About ITEX

Built Around Yield, Not Hype

ITEX focuses on one thing: helping electronics manufacturers improve yield. Our customers include SMT job shops, high-mix/low-volume assembly lines, and contract manufacturers supplying demanding industries.

Each formulation goes through strict testing for printability, slump, and reflow reliability. With reliable supply and export-ready logistics, ITEX is a soldering materials partner you can build your process around.

Why ITEX

Why Process Engineers Choose ITEX

  • Consistent printing: Stable paste rheology for predictable deposit volumes over long runs.
  • Fine-pitch capability: Type 4 powders and controlled flux system for dense boards.
  • No-clean convenience: Reduced need for post-reflow cleaning, where process specs allow.
  • Export-ready logistics: Experience shipping to global EMS and OEM customers.
Contact

Request a Quote or Technical Details

Share your alloy, quantity, and destination requirements. We’ll respond with pricing, availability, and shipping options.

Email
sales@itex.ltd
Phone
+1 914 294 3650
WhatsApp
+1 914 294 3650
WeChat
ID: alargeamountofgold
Company address
Yiwu Jinning Trade Company
Room 301, Unit 2, Building 110, Jiangnan Third District, Jiangdong Street,
Yiwu City, Jinhua City, Zhejiang, China
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